Passive infrared thermography applied to fault detection systems: A revision

Abstract

This article provides a review of the methodology used in passive infrared thermography as a condition monitoring tool. It focuses on three main industrial applications, electrical, electronic, and mechanical. Basic concepts of the technique and the devices in which it has been applied are discussed. In addition, discusses the most commonly used methods to improve inspection using thermographic analysis. It highlights the internal and external technical factors affecting image quality and the classifier's decision process. It also presents in this context a comparison between color spaces, feature reduction methods, and the most widely used classifiers in recent years.